Cirtek Electronics Corporation(CIRTEK) was incorporated in May 1984 as an independent and privately owned subcontractor for semiconductor devices. CIRTEK provides complete turnkey solutions that include services from wafer probe, wafer back grinding, assembly and packaging and final testing of semiconductor devices up to drop shipments to our Customer's end users.

Package offering ranges from simple single IC to multiple die assembly and from simple components assembly to complex networks multi-component devices. Package outlines are either customer specific and/or compliant to the JEDECstandard.